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Qualcomm's Front End Subsystem Marks Accelerating Adoption of CMOS PAs in Mobile Phones
Does This Mean The Demise of GaAs?
Boston, MA - March 19, 2013 - Qualcomm's new "RF360," a revolutionary family of RF front-end cellphones products including multiband CMOS PAs, marks the company' entry into the $5 billion cellular RF front-end component market, as explored in the new Strategy Analytics report "PA Market in Flux: CMOS PAs and Envelope Tracking Emerge as Major Themes at MWC 2013." The report evaluates Qualcomm's RF360 in the context of new developments in power management and high-efficiency multiband power amplifiers by established PA suppliers, other chipset suppliers and power management IC specialists.
Christopher Taylor, Director of the Strategy Analytics RF & Wireless Components market research service stated that, "Qualcomm is the first to launch a CMOS PA alternative to GaAs-based multiband, multimode PAs for mid - to high-tier 3G / 4G smartphones, a phone segment formerly the exclusive domain of GaAs PAs. Envelope tracking power management enables this, and we expect adoption of CMOS PAs from Qualcomm and others to accelerate in mobile phones as a result."
Eric Higham, Director of the Strategy Analytics GaAs and Compound Semiconductor market research service added that, "GaAs is not dead yet, but GaAs PA suppliers will have to continue to innovate to maintain an edge over CMOS, and they may also need to consider offering their own CMOS PAs for the most cost-sensitive phones, as Skyworks and RFMD now do."
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